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 HD74LV00A
Quad. 2-input NAND Gates
REJ03D0225-0300Z (Previous ADE-205-240A (Z)) Rev.3.00 May 20, 2004
Description
The HD74LV00A has four two-input NAND gates in a 14-pin package. Low-voltage and high-speed operation is suitable for the battery-powered products (e.g., notebook computers), and the low-power consumption extends the battery life.
Features
* * * * * * * VCC = 2.0 V to 5.5 V operation All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VO (Max.) = 5.5 V (@VCC = 0 V) Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25C) Typical VOH undershoot > 2.3 V (@VCC = 3.3 V, Ta = 25C) Output current 6 mA (@VCC = 3.0 V to 3.6 V), 12 mA (@VCC = 4.5 V to 5.5 V) Ordering Information
Package Type SOP-14 pin(JEITA) SOP-14 pin(JEDEC) TSSOP-14 pin Package Code FP-14DAV FP-14DNV TTP-14DV Package Abbreviation FP RP T Taping Abbreviation (Quantity) EL (2,000 pcs/reel) EL (2,500 pcs/reel) ELL (2,000 pcs/reel)
Part Name HD74LV00AFPEL HD74LV00ARPEL HD74LV00ATELL
Note: Please consult the sales office for the above package availability.
Function Table
Inputs A H L X Note: H: High level L: Low level X: Immaterial B H X L Output Y L H H
Rev.3.00, May 20, 2004, page 1 of 8
HD74LV00A
Pin Arrangement
1A 1B 1Y
1 2 3
14 VCC 13 4B 12 4A 11 4Y 10 3B 9 3A
2A 4 2B 2Y 5 6
GND 7
8 3Y
(Top view)
Absolute Maximum Ratings
Item Supply voltage range Input voltage range*1 Output voltage range*1, 2 Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation at Ta = 25C (in still air)*3 Storage temperature Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg Ratings -0.5 to 7.0 -0.5 to 7.0 -0.5 to VCC + 0.5 -0.5 to 7.0 -20 50 25 50 785 500 -65 to 150 Unit V V V mA mA mA mA mW C Conditions
Output: H or L VCC: OFF VI < 0 VO < 0 or VO > VCC VO = 0 to VCC
SOP TSSOP
Notes: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150C.
Rev.3.00, May 20, 2004, page 2 of 8
HD74LV00A
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Output current Symbol VCC VI VO IOH Min 2.0 0 0 -- -- -- -- -- -- -- -- 0 0 0 -40 Max 5.5 5.5 VCC -50 -2 -6 -12 50 2 6 12 200 100 20 85 Unit V V V
A
Conditions
mA
IOL
A
mA
Input transition rise or fall rate
t /v
ns/V
VCC = 2.0 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V VCC = 2.0 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V
Operating free-air temperature
Ta
C
Note: Unused or floating inputs must be held high or low.
Logic Diagram
A B Y
Rev.3.00, May 20, 2004, page 3 of 8
HD74LV00A
DC Electrical Characteristics
Ta = -40 to 85C Item Input voltage Symbol VIH VCC (V)* 2.0 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 2.0 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 Min to Max 2.3 3.0 4.5 Min to Max 2.3 3.0 4.5 0 to 5.5 5.5 0 3.3 Min 1.5 VCCx 0.7 VCCx 0.7 VCCx 0.7 -- -- -- -- VCC - 0.1 2.0 2.48 3.8 -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 3.3 Max -- -- -- -- 0.5 VCCx 0.3 VCCx 0.3 VCCx 0.3 -- -- -- -- 0.1 0.4 0.44 0.55 1 20 5 -- Unit V Test Conditions
VIL
Output voltage
VOH
V
VOL
Input current Quiescent supply current Output leakage current Input capacitance
IIN ICC IOFF CIN
A A A pF
IOH = -50 A IOH = -2 mA IOH = -6 mA IOH = -12 mA IOL = 50 A IOL = 2 mA IOL = 6 mA IOL = 12 mA VIN = 5.5 V or GND VIN = VCC or GND, IO = 0 VI or VO = 0 V to 5.5 V VI = VCC or GND
Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions.
Switching Characteristics
VCC = 2.5 0.2 V Ta = 25C Item Propagation delay time Symbol tPLH tPHL Min -- -- Typ 7.1 9.6 Max 12.9 16.6 Ta = -40 to 85C Min 1.0 1.0 Max 15.0 20.0 Unit ns Test Conditions CL = 15 pF CL = 50 pF FROM (Input) A or B TO (Output) Y
VCC = 3.3 0.3 V Ta = 25C Item Propagation delay time Symbol tPLH tPHL Min -- -- Typ 5.0 6.9 Max 7.9 11.4 Ta = -40 to 85C Min 1.0 1.0 Max 9.5 13.0 Unit ns Test Conditions CL = 15 pF CL = 50 pF FROM (Input) A or B TO (Output) Y
VCC = 5.0 0.5 V Ta = 25C Item Propagation delay time Symbol tPLH tPHL Min -- -- Typ 3.6 4.9 Max 5.5 7.5 Ta = -40 to 85C Min 1.0 1.0 Max 6.5 8.5 Unit ns Test Conditions CL = 15 pF CL = 50 pF FROM (Input) A or B TO (Output) Y
Rev.3.00, May 20, 2004, page 4 of 8
HD74LV00A
Operating Characteristics
CL = 50 pF Ta = 25C Item Power dissipation capacitance Symbol CPD VCC (V) 3.3 5.0 Min -- -- Typ 9.5 11.0 Max -- -- Unit pF Test Conditions f = 10 MHz
Noise Characteristics
CL = 50 pF Ta = 25C Item Quiet output, maximum dynamic VOL Quiet output, minimum dynamic VOL Quiet output, minimum dynamic VOH High-level dynamic input voltage Low-level dynamic input voltage Symbol VOL (P) VOL (V) VOH (V) VIH (D) VIL (D) VCC (V) 3.3 3.3 3.3 3.3 3.3 Min -- -- -- 2.31 -- Typ 0.2 -0.1 3.1 -- -- Max 0.8 -0.8 -- -- 0.99 Unit V V V V V Test Conditions
Rev.3.00, May 20, 2004, page 5 of 8
HD74LV00A
Test Circuit
Measurement point
CL*
Note: CL includes the probe and fig capacitance.
* Waveform - 1
tr 90% 50% VCC 10% t PLH 90% 50% VCC
tf VCC 10% t PHL 0V
Input
VOH In phase output t PHL 50% VCC 50% VCC VOL t PLH VOH Out of phase output 50% VCC 50% VCC VOL
Notes: 1. Input waveform: PRR 1 MHz, Zo = 50 , tr 3 ns, t f 3 ns 2. The output are measured one at a time with one transition per measurement.
Rev.3.00, May 20, 2004, page 6 of 8
HD74LV00A
Package Dimensions
As of January, 2003
Unit: mm
10.06 10.5 Max 14 8
1
7
5.5
*0.20 0.05
2.20 Max
0.20 7.80 + 0.30 -
1.42 Max
1.15 0 - 8 0.70 0.20
1.27 *0.40 0.06
0.12 M
Package Code JEDEC JEITA Mass (reference value) FP-14DAV -- Conforms 0.23 g
*Ni/Pd/Au plating
0.10 0.10
0.15
As of January, 2003
Unit: mm
8.65 9.05 Max 14 8
1
1.75 Max
*0.20 0.05
7
3.95
6.10 - 0.30 1.08
+ 0.10
0.635 Max
0 - 8
+ 0.11
1.27 *0.40 0.06
0.14 - 0.04
0.60 - 0.20
+ 0.67
0.15 0.25 M
Package Code JEDEC JEITA Mass (reference value) FP-14DNV Conforms Conforms 0.13 g
*Ni/Pd/Au plating
Rev.3.00, May 20, 2004, page 7 of 8
HD74LV00A
As of January, 2003
Unit: mm
5.00 5.30 Max 14 8
1
7 0.65 1.0 0.13 M 6.40 0.20 0.83 Max 0 - 8 0.50 0.10
*0.20 0.05
4.40
*0.15 0.05
1.10 Max
0.10
0.07 +0.03 -0.04
*Ni/Pd/Au plating
Package Code JEDEC JEITA Mass (reference value)
TTP-14DV -- -- 0.05 g
Rev.3.00, May 20, 2004, page 8 of 8
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
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